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19-1970; Rev 1; 10/01
MAX3970
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PART MAX3970U/D TEMP. RANGE 0C to +85C PIN-PACKAGE Dice
Note: Dice are designed to operate over a 0C to +110C junction temperature (TJ) range, but are tested and guaranteed at TA = +25C.
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3.3V SUPPLY FILTERING VCC1 VCC2
MAX3970
FILTER 200pF IN OUT+ OUT1.0V RF 0.01F
3.3V
LIMITING AMPLIFIER 0.01F
RSSI
________________________________________________________________ Maxim Integrated Products
1
MAX3970
ABSOLUTE MAXIMUM RATINGS
Terminal Voltage Voltage VCC1 and VCC2 ...................................-0.3V to +5.0V Voltage at FILTER.................................-0.3V to (VCC1 + 0.3V) Voltage at OUT+, OUT-, RSSI ........................0V to (VCC + 0.5V) Input Current IN, TEST ............................................................-5mA to +5mA Operating Junction Temperature Range ...........-40C to +125C Storage Temperature Range .............................-60C to +150C Die Attach Process Temperature.....................................+400C
Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(VCC = +3.0V to +3.6V, output loads = 50 to VCC, TJ = 0C to +110C. Typical values are at VCC = +3.3V, CIN = 0.25pF, LIN = 1.7nH, TA = +25C, unless otherwise noted.) (Note 1)
PARAMETER Supply Current Maximum DC Input Current Input Linear Range Input Referred RMS Noise Input Referred Noise Density Output Resistance (per side) Small Signal Transimpedance Small Signal Bandwidth Low Frequency Cut-Off Deterministic Jitter Input Bias Voltage RSSI Gain RSSI Bandwidth Photodiode Filter Resistance Maximum Differential Output Voltage RFILTER VOD-MAX Input = 1mAp-p DJ VIN IIN = 100A to 1mA IIN = 10A to 100A 900 1200 10 330 350 IIN < 1.3mA IIN = 2.0mA ROUT Z21 BW Differential output 10Ap-p < Input < 100Ap-p in SYMBOL ICC IIN-MAX 0.95 < Linearity < 1.05 f = 7.5GHz (Note 2) f = 10GHz (Note 2) f = 10GHz (Note 2) 43 340 7.4 1.6 100 130 1.1 1.1 11 50 590 9 70 8 16 0.9 1200 1800 70 410 470 500 700 22 0.96 1500 3000 58 730 13.2 150 1.45 1.45 CONDITIONS MIN TYP 46 MAX 62 UNITS mA mA Ap-p A pA/ (Hz)1/2 GHz kHz psp-p V V/A kHz mVp-p
Note 1: AC characteristics are guaranteed by design and characterization. Note 2: Input Referred Noise is calculated as RMS Output Noise / (Gain at f = 10MHz). Noise Density is (Input-Referred Noise) / bandwidth. Noise measurements are made using 4-pole Bessel filters.
2
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MAX3970
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(VCC = +3.3V, TA = +25C, input bondwire inductance = 1.0nH, unless otherwise noted. CIN is total source capacitance to die. All measurements made on MAX3970 EV Kit.)
INPUT REFERRED NOISE vs. CAPACITANCE
MAX3970 toc01
INPUT REFERRED RMS NOISE CURRENT vs. AVERAGE INPUT CURRENT
MAX3970 toc02
DETERMINISTIC JITTER vs. INPUT AMPLITUDE
INPUT = k28.5 PATTERN
MAX3970 toc03
1.4 INPUT REFFERED NOISE (ARMS) 1.3 1.2 1.1 1.0
NOISE IS MEASURED IN A BANDWIDTH OF 7.5GHz.
3.0 2.5 RMS NOISE CURRENT (A) 2.0 1.5 1.0 0.5 0
30
25 JITTER (psp-p)
20
15
TJ = 100C TJ = 50C TJ = 0C
0.9 0.8 0.1
10
5 1 10 100 1000 10000 10 100 1000 10000 DC INPUT CURRENT (A) AMPLITUDE (Ap-p)
0.2
0.3
0.4 CIN (pF)
0.5
0.6
0.7
DETERMINISTIC JITTER vs. AVERAGE INPUT CURRENT
MAX3970 toc04
OUTPUT AMPLITUDE vs. TEMPERATURE
MAX3970 toc05
DC TRANSFER FUNCTION
300 DC CANCELLATION 250 CIRCUIT DISABLED, 200 VFILTER = GND 150 100 50 0 -50 -100 -150 -200 -250 -300 -2500 -1500 -500
MAX3970 toc06
40
SIGNAL INPUT = 50Ap-p
700 DIFFERENTIAL AMPLITUDE (mVp-p) 600 500 400 300
INPUT = 1mAp-p, 00-11 PATTERN AT 10.0Gbps
20
10
0 1 10 100 1000 INPUT CURRENT (A)
200 -50
-25
0
25
50
75
100
OUTPUT VOLTAGE (mV)
30 JITTER (psp-p)
500
1500
2500
AMBIENT TEMPERATURE (C)
INPUT CURRENT (A)
EYE DIAGRAM (50Ap-p INPUT)
MAX3970 toc07
EYE DIAGRAM (2.0mAp-p INPUT)
223 -1PRBS 2mA INPUT
MAX3970 toc08
SIMULATED FREQUENCY RESPONSE vs. INPUT INDUCTANCE
65 60 MAGNITUDE S21 (dB) 55 50 45 40 35 30 25 LIN = 1.5nH LIN = 1.0nH LIN = 0.5nH LIN = 2.0nH
MAX3970 toc09
70
223 -1PRBS 50A INPUT
5mV/div
100mV/div
20ps/div
20ps/div
1k
10k 100k 1M 10M 100M 1G FREQUENCY (Hz)
10G 100G
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3
MAX3970
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(VCC = +3.3V, TA = +25C, input bondwire inductance = 1.0nH, unless otherwise noted. CIN is total source capacitance to die. All measurements made on MAX3970 EV Kit.)
SIMULATED FREQUENCY RESPONSE vs. INPUT INDUCTANCE
MAX3970 toc10
POWER SUPPLY REJECTION RATIO vs. FREQUENCY
5 SUPPLY REJECTION (dB) 10 15 20 25 30 35 40 -0.40 100k 1M 10M FREQUENCY (Hz) 100M 1G PSRR = -20 LOG VOUT VCC
MAX3970 toc11
OUTPUT COMMON-MODE VOLTAGE (REFERENCED TO VCC) vs. TEMPERATURE
IIN = 0, iIN = 0
MAX3970 toc12
58 56 MAGNITUDE S21 (dB) 54 52 LIN = 1.0nH 50 LIN = 0.5nH 48 46 1G 10G FREQUENCY (Hz) LIN = 2.0nH LIN = 1.5nH
0
-0.20 COMMON-MODE VOLTAGE (V)
-0.25 VCC = +3.0V -0.30 VCC = +3.3V VCC = +3.6V -0.35
100G
0
20
40
60
80
AMBIENT TEMPERATURE (C)
S22 vs. FREQUENCY
MAX3970 toc13
OUTPUT VSWR (DIFFERENTIAL)
MAX3970 toc14
RSSI OUTPUT VOLTAGE vs. AVERAGE INPUT CURRENT
MAX3970 toc15
10 0 MAGNITUDE S22 (dB) -10
3.0 2.8 2.6 2.4 2.2 VSWR 2.0 1.8 1.6 1.4 1.2 1.0 0.8 100M
2.5
2.0
-20 -30 -40 -50 -60 100M
VRSSI (V)
1.5
1.0
0.5
0 1G FREQUENCY (Hz) 10G 0 500 1000 CURRENT (mA) 1500 2000
1G FREQUENCY (Hz)
10G
SIMULATED SMALL SIGNAL BANDWIDTH vs. CAPACITANCE
MAX3970 toc16
SMALL SIGNAL TRANSIMPEDANCE vs. TEMPERATURE
MAX3970 toc17
15 14 13 -3dB BANDWIDTH (GHz) 12 11 10 9 8 7 6 5 4 0.1 0.2 0.3 0.4 CIN (pF) 0.5 0.6 TJ = 100C TJ = 0C TJ = 50C
700 600 TRANSIMPEDANCE (V/A) 500 400 300 200 100 0
0.7
-50
-25
0
25
50
75
100
AMBIENT TEMPERATURE (C)
4
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MAX3970
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PAD BP1, BP2, BP18 BP3 BP4 BP5 BP6, BP7 BP8, BP9 BP10, BP13 BP11 BP12 BP14, BP15 BP16 BP17 NAME VCC1 FILTER TEST IN GND1 GND2 GND3 OUTOUT+ VCC2 RSSI FUNCTION Power Supply. Provides supply voltage to input circuitry and bias to the photodiode via an internal 410 resistor. Provides bias voltage for the photodiode through a 410 resistor to VCC1. When grounded, this pin disables the DC cancellation circuit to allow a DC path from IN to OUT+ and OUT- for testing.
Test Pad. This pad is connected to IN via a 1k resistor.
Amplifier Input. Accepts photodiode input current. Ground Ground Ground Negative CML Output. Current flowing into IN causes OUT- to decrease. Positive CML Output. Current flowing into IN causes OUT+ to increase. Power Supply. Provides supply voltage to the output buffers. Received-Signal Strength Indicator. This pin provides a voltage proportional to the DC input current. Monitor this output during assembly to optimally align the photodiode to the optics.
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5
MAX3970
RF 420 TRANSIMPEDANCE AMPLIFIER
MAX3970
VOLTAGE AMPLIFIER OUTPUT BUFFER
50 OUT+
IN OUT50 DC CANCELLATION CIRCUIT 1k TEST RSSI VCC1 BUF 410 FILTER DISABLE BUF LOWPASS FILTER
AMPLITUDE
AMPLITUDE INPUT FROM PHOTODIODE OUTPUT (LARGE SIGNALS) OUTPUT (SMALL SIGNALS)
TIME
TIME
INPUT AFTER DC CANCELATION
INOISE = (VNOISE)(CPD) / (RFILTER)(CFILTER)
6
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MAX3970
CFILTER = (VNOISE)(CPD) / (RFILTER)(INOISE)
CFILTER = (100mV)(0.25pF) / (410)(300nA) 200pF
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VCC TEST 50 50 OUT+ 1k
OUT-
IN
12.5
12.5
GND GND
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7
MAX3970
VCC
VCC1
410 FILTER
22pF
RSSI
GND
GND
P1
14.1 x in x (re + 1) Sensitivity = 10log x 1000 dBm 2 x x (re - 1)
OPTICAL POWER
PAVE
P0 TIME
2mA Overload = 10log x 1000 dBm 2x
60A(r + 1) e Linear Range = 10 log x 1000 dBm 2 x x (re - 1)
8
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MAX3970
*
PARAMETER Average Power Extinction Ratio Optical Power of a "1" Optical Power of a "0" Optical Modulation Amplitude SYMBOL PAVG re P1 P0 PIN RELATION PAVG = (P0 + P1) / 2 re = P1 / P0
(129.8, 971.6)
P1 = 2 PAVG
re re + 1
(0, 799.4) 3
MAX3970
P0 = 2PAVG / (re+1)
(512, 548.8) IN
r -1 PIN = P1 - P0 = 2 PAVG e re + 1
*Assuming a 50% average mark density.
(0, 169.4) HF98Z (381.8, 0)
y
PAD BP1 BP2 BP3 BP4 BP5 BP6 BP7 BP8 BP9 BP10 BP11 BP12 BP13 BP14 BP15 BP16 BP17 BP18
NAME VCC1 VCC1 FILTER TEST IN GND1 GND1 GND2 GND2 GND3 OUTOUT+ GND3 VCC2 VCC2 VCC2 RSSI VCC1
COORDINATES X 0 0 0 0 0 0 129.8 255.8 381.8 512 512 512 512 512 512 381.8 255.8 129.8 Y 799.4 673.4 547.4 421.4 295.4 169.4 0 0 0 170.8 296.8 422.8 548.8 674.8 800.8 971.6 971.6 971.6
x
* All dimensions are in microns. * Pad dimensions: METAL H=102.4 microns W=102.4microns PASSIVATION OPENING 94.4 microns 94.4microns
* Coordinates specify lower left corner of the pad.
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9
MAX3970
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VCC1 RSSI VCC2
VCC1 VCC1 FILTER
VCC2 VCC2 GND3
TEST IN GND1
OUT+ 0.053" (1.345mm) OUT-
GND3
DIE IDENTIFICATION GND1 GND2
GND2
0.034" (0.864mm)
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TRANSISTOR COUNT: 125 PROCESS: SILICON GERMANIUM BIPOLAR
10 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 (c) 2001 Maxim Integrated Products is a registered trademark of Maxim Integrated Products.

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